Dr. Chong Leong Gan
Micron Taiwan, China
Biography:
Dr. Chong Leong, Gan received his B.S. degree in Chemical Engineering from National University of Malaysia in 2000, M.S. degree in Chemical Instrumentation in 2003 from University Science Malaysia, and Ph.D. in Nanoelectronic Engineering from University Malaysia Perlis, Malaysia in 2015. He is Senior Member of IEEE, Fellow of Institute of Materials, Minerals & Mining, UK, Fellow of Malaysian Institute of Chemistry, Fellow of Institute of Physics, UK and Royal Society of Chemistry, UK. Since 2000, he has been a Quality and Reliability MTS with Altera, Product Engineering Manager with Osram Opto-Semiconductors, Senior R&D Engineering Manager with Western Digital and currently working as Package Characterization Director with Micron Taiwan. He is recipient of IEEE EPS Distinguish Technical Leadership award in 2021, Emerald Outstanding Reviewer in 2021 and ASME JEP Reviewer of the Year in 2022. His research interests including semiconductor packaging reliability, electronic packaging materials characterization, nanomaterials, and radiation reliability. He has published more than 75 international journal articles, 1 book with Springer Publisher. CL serves as Editorial boards with more than 30 international journals and with 28 patents issued/ filing in US and China patent offices.