Prof. Chuantong Chen
Tokyo City University, Japan

Biography:

Chuantong Chen (IEEE senior number), received the Ph.D degree in mechanical engineering from Nagoya Institute of Technology, Japan, in 2015. From 2016 to 2019, he was an assistant professor at Institute Scientific and Industrial Research, Osaka University, Japan. He became to an associate professor in Osaka University from 2020. His research interest includes surface and interface materials, lead-free soldering, Ag sinter joining, Nano-joining, 3D packaging, and power electronics packaging. He has published more than 120 SCI journal papers and 80 IEEE conference papers in above fields. Prof. Chen was a recipient of some awards and honors including the IEEE EMPC Best poster award, IEEE ICEP Outstanding Technical paper Award in 2023, and the IEEE CPMT Japan Chapter Young in 2019. He also applied and obtained 20 Japanese and international patents, including 3 US patents. Prof. Chen serves as technology committee member of IEEE ICEPT from 2020, and IEEE ICEP from 2024, and serves as the committee member of Kansai branch of the Japanese Electronics Packaging Society, and a committee member of international standardization for the third-generation semiconductor packaging substrate material, interconnections, heat conduction evaluation system and equipment in Japan from 2018.