Prof.  Shu-Lin  Bai
Peking University,  China

Title: Strategy on Design and Manufacture of Polymer Composites with High Thermal Conductivity

Abstract:

With the rapid development of electronics, the temperature rise of chips increases enormously, so thermal management becomes urgent and imperative task. One solution is to invent new thermal interface materials (TIMs) which can effective dissipate the heat. Polymer composites have good flexibility and low thermal interface resistance when coupled with heat source and heat sink, so they are often used as TIMs or thermal pad. However, the intrinsic thermal conductivity (TC) of polymer is as low as 0.2 Wm-1K-1, so the fillers with high TC is usually added into polymer to make polymer composites. We developed two kinds of TIMs, one is electrically insulating and composed of hexagonal boron nitride (h-BN) sheets, another is electrically conductive with graphene/graphite sheets. Both TIMs have very high TC compared with traditional TIMs. The filler alignment and interconnection are very important to get high TC along desired direction. Super high TC more than 100 Wm-1K-1 can only be obtained with continuous films of graphene or h-BN because the high heat transfer way is constructed along the film plane. Our recent work provides new processing methods of TIMs fabrication to achieve above goals. Further, the tentative application to the temperature control of LED and lithium battery shows good performance of the TIMs, and it may provide effective and facile routes for developing high TC polymer composites and their possible engineering application in thermal management of electronic devices.

Biography:

Mr. Shu-Lin Bai is full professor at School of Materials Science and Engineering, Peking University, China. He obtained BS (1983) on Materials Science and Engineering and MS (1986) on Experimental Mechanics from Dalian University of Science and Technology, China respectively, then PhD (1993) on Mechanics and Materials from Ecole Centrale des Arts et Manufactures de Paris, France. He joined College of Engineering of Peking University in 1994 and moved to School of Materials Science and Engineering in 2020. His expertise is on processing and performance of polymer composites filled with particles and fibers. His current research work focuses on heat management materials (mainly thermal interface materials-TIMs). He developed many kinds of TIMs composed of polymer matrix such as silicon rubber, PDMS, PA, PP, etc. and fillers/films such as graphene, CNTs, h-BN, graphite films, etc. Those TIMs have thermal conductivity varied from few Wm-1K-1 to several hundred Wm-1K-1. He was founder of conference of Asia-Europe Symposium on Processing and Properties of Reinforced Polymers. He has published more than 200 papers.